Online Catalogue - Exhibitor News

A 2-in-1 semiconductor dispensing and die bonding equipment for silver paste and other adhesives, supporting dot dispensing, pattern dispensing, and dip coating processes. Applicable to small-signal silver epoxy process power devices, sensors, SIP, Chiplet, IC, MOS, and other products.

New Equipment Solution: Turret-Type Mounting

The turret-type mounting mechanism is an innovative chip mounting method pioneered by Zhuoxing Semiconductor in the industry. The semiconductor silver epoxy die attach machine is equipped with six individual nozzles and adopts a multi-process parallel operation design. It performs chip mounting through multi-station rotating cycles, enabling simultaneous pick-up, mounting, and real-time vision compensation. This achieves the dual effect of "non-stop mounting" and "shortened production cycle," increasing production efficiency by 60%.

The standard configuration of its mounting worktable is as follows:

Meanwhile, Zhuoxing Semiconductor's self-developed pressure control system adopts direct motor connection, enabling the mounting structure to maintain stable pressure control under different resistances and achieve dynamic pressure control. Its equipment pressure value: 30-300g (±5g).

Adapting to Multiple Processes: Three Dispensing Groups or Optional Dip Coating

The semiconductor silver epoxy die attach machine supports configuration with up to four dispensing mechanisms. The machine supports both chip dispensing and packaging operations simultaneously, achieving multiple functions with one device. Customers do not need to purchase additional dispensers, providing manufacturers with a better solution.

In addition, the silver epoxy die attach machine is suitable not only for dot and pattern dispensing processes but also for multi-needle dip coating processes. Process structures can be changed at any time, truly realizing "one machine, multiple uses"!

Dispensing Features:

① Compatible with different dispensing controllers to meet customers' multiple process requirements
② Optional auxiliary functions such as frame heating based on customized process characteristics
③ Enables visual recognition of dispensing positions and supports import of preset patterns and path dispensing

Dispensing Mechanism:

Adapting to Multiple Material Types: Multi-Size Wafers and Custom Trays

The semiconductor silver epoxy die attach machine supports various sizes of blue film feeding, including 2/4/6/8/12-inch wafers, with automatic film expansion for 12-inch wafers. It supports single 6-inch mother-daughter rings, Waffle Pack, and GelPAK, and tray customization is available based on specific requirements.

High Precision Guarantee: Downward Vision Accuracy Compensation

In terms of accuracy, the machine's mounting X/Y precision reaches ±15μm, angular error ≤ ±1°, production cycle 22.5k/h. Due to the turret structure design for mounting, Zhuoxing Semiconductor flexibly installs downward vision cameras or transfer stages at stations during actual operation, achieving simultaneous chip mounting and accuracy compensation, with AI automatic accuracy compensation and pressure correction functions.

Against the backdrop of increasingly fierce industry competition, Zhuoxing Semiconductor is committed to providing more manufacturers with efficient and precise solutions, supporting the development of the semiconductor industry with excellent packaging technology.

About Us

Founded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.

Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.

We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts.