Online Catalogue - Exhibitor News

Performance of Shanmu Intelligent Solder Paste Cabinets at productronica China Performance at the Munich Exhibition SUNMOON Intelligent Solder Paste Storage Cabinets were star exhibits at the 2026 productronica Shanghai, located at Booth 3660, Hall E3. The equipment attracted a large number of professional visitors from automotive electronics, EMS factories, consumer electronics and precision manufacturing industries.Live demonstrations of intelligent temperature control, automatic conditioning, FIFO management and full-process traceability were highly recognized by on-site customers.Many enterprises reached on-site cooperation intentions and procurement intentions, making it one of the most popular SMT material management solutions at the exhibition. Core Advantages Intelligent & Fully Automatic Management Integrates refrigeration, intelligent thawing, automatic stirring, FIFO, code scanning and data traceability in one system, reducing manual operation and human error. Precise Temperature & Humidity Control Stable temperature control at 1–10℃ with an accuracy of ±1℃, ensuring solder paste viscosity and printing quality, effectively reducing defective products caused by improper material storage. Complete Traceability & MES Compatibility Supports full life cycle record of each solder paste bottle, real-time data upload, and seamless docking with MES/SFCS systems, fully meeting audit requirements such as IATF16949. Stable & Reliable Performance With good insulation design and optional power-off protection, the internal temperature can be maintained for a long time after power failure, avoiding material waste and quality risks. High Capacity & Flexible Application Available in multiple models (300P, 600P, 200P) for different production scales, suitable for mass production lines as well as small-batch and multi-variety manufacturing.  Awards & Qualifications More than 30 national patents in intelligent control, temperature control and structural designRecognized as a leading brand in SMT intelligent storageQualified supplier for automotive electronics, medical electronics and military electronicsCertified by many well-known manufacturers in the electronics manufacturing industry Application Fields Automotive Electronics & New Energy Vehicle ComponentsConsumer Electronics (smartphones, computers, home appliances)Medical Electronics & Industrial Control EquipmentAerospace & High-Precision Electronic ManufacturingEMS & OEM/ODM FactoriesPrecision Electronics Assembly & SMT Production Lines

SUNMOON Intelligent Temperature and Humidity Control Machine is a core environmental control equipment specially designed for the SMT industry. As the perfect companion for solder paste printers, its core value lies in safeguarding the overall quality of SMT printing through precise temperature and humidity control, helping enterprises avoid printing defects and improve production efficiency. It is one of the key new products highlighted at the 2026 Munich Shanghai Electronics Show, suitable for SMT production scenarios in various fields such as industrial electronics and consumer electronics.I. Core FunctionsPrecise Temperature and Humidity Control: It mainly achieves precise control of temperature between 20-26℃ and humidity between 40%-60%RH, with a temperature accuracy of ±1℃ and a humidity accuracy of ±5%RH. Through dual cooling and humidification technologies, it stabilizes the viscosity of solder paste, fundamentally avoiding printing problems such as insufficient solder, excessive solder, and cold solder caused by environmental fluctuations, which meets the core needs of the SMT printing process.Real-time Monitoring and Traceability: Equipped with high-precision digital sensors, it collects temperature and humidity data in real time, synchronously displays digital values and temperature curves, and supports data query and export. It can realize the full-process traceability of temperature and humidity control, meeting the factory audit and quality management requirements of high-end manufacturing fields such as automotive electronics and aerospace, with conclusive evidence to avoid quality disputes.Intelligent Linkage and Adaptation: Adopting a modular design, it can perfectly match all mainstream solder paste printers on the market without modification. At the same time, it supports in-depth integration with the enterprise's existing MES or SFCS systems, which can passively receive production instructions and actively push equipment operation and temperature and humidity data, integrating into the factory's digital production system to achieve automated process collaboration.Safety Protection and Emergency Guarantee: It has a complete safety protection mechanism and supports power failure emergency response. The sealed design can maintain the temperature and humidity at the standard state for 4-6 hours without opening the door when the power is cut off. UPS uninterruptible power supply can be optionally configured to extend the emergency power supply to more than 8 hours, ensuring that the quality of solder paste is not affected by sudden power failure and avoiding the risk of material scrapping.Convenient Operation and Maintenance Management: Equipped with a clear human-machine interface, it can manually set temperature and humidity parameters and check the equipment operation status, supporting remote monitoring and parameter adjustment without frequent manual on-duty. The equipment is simple to maintain, and the sensor only needs regular calibration, which greatly reduces the manual management cost and is suitable for multi-shift production scenarios.II. Core AdvantagesStrong Scene Adaptability: Deeply engaged in the segmented field of the SMT industry, focusing on the whole life cycle management of solder paste. The equipment design is in line with the actual production needs of the SMT site. It can be flexibly adapted to both small and medium-sized production lines and large-scale production workshops without additional modification of the production line, with convenient and efficient deployment.Stable and Reliable Precision: Relying on the control architecture of PLC plus industrial computer and combined with PID control algorithm, it realizes dynamic and precise control of temperature and humidity with stable operation and no fluctuation. It effectively ensures the consistency of solder paste printing quality, reduces printing defects, lowers material loss and rework costs, and improves production yield.Outstanding Cost-Effectiveness: Compared with similar equipment, it balances high precision and practicality, with more advantages in initial investment cost. At the same time, the equipment is energy-saving and efficient, which can reduce energy consumption expenditure. It also has large-scale delivery capacity and timely after-sales response, adapting to the long-term stable production needs of enterprises. It has served more than 500 customers worldwide with an excellent market reputation.Guaranteed Compliance: The equipment has passed international certifications such as ISO9001, ISO14001, CE and UL, and has a number of patents and software copyrights. The temperature and humidity traceability function and safety protection design are in line with the factory audit standards of high-end manufacturing fields, helping enterprises successfully pass customer factory audits and improve market competitiveness.Easy to Operate and Understand: Humanized design runs through the whole process. Parameter setting is simple, and the operation status is intuitive. No professional technicians are required. Ordinary employees can get started after simple training. At the same time, it supports remote operation and maintenance, further improving management efficiency and adapting to the needs of multi-shift operation factories.You can experience the equipment operation up close at the exhibition, intuitively feel its precise control advantages, unlock new solutions for improving SMT printing quality, and help enterprises achieve efficient, compliant and low-cost production.

 YiHan (Shenzhen) Automation Equipment Co., Ltd. participated in the 14th Shenzhen International Connector, Wire Harness and Processing Equipment Exhibition (ICH Shenzhen). The company displayed a full range of high-efficiency wire harness processing equipment, including fully automatic double crimp & seal inserting machines, double-end crimping with single-end sheath inserting machines, integrated stripping & crimping machines, tubular terminal crimping machines, etc. These integrated solutions cover wire cutting, stripping, terminal crimping, waterproof seal inserting, and sheath assembling, featuring high precision, stability and intelligence. They are widely used in automotive, new energy, industrial control and other fields. During the exhibition, YiHan Automation communicated deeply with domestic and overseas customers, and received strong market attention and wide recognition for its professional equipment and reliable quality.

In the core process of construction, the firmness of rebar tying directly determines the safety and durability of a project. Traditional manual tying relies on binding wire, which is not only cumbersome, time-consuming and labor-intensive, but also often leads to uneven tightness, missed ties and other defects. This not only hampers construction efficiency but also poses potential safety hazards, becoming a bottleneck restricting project progress. With the popularization of intelligent construction, the emergence of nylon cable tie machines has completely transformed this situation. And with its robust strength, the SWIFT brand has become a trusted choice in the field of rebar tying. Compared with traditional manual tying, nylon cable tie machines achieve efficient and standardized rebar fixing thanks to their automated advantages. Eliminating the tedious steps of taking, threading and tightening ties, operators only need to gently pull the trigger to complete the entire process of feeding, tensioning and tail cutting within one second. Efficiency is improved by 3 to 4 times compared with manual work, and one machine can replace the workload of 5 to 6 workers, greatly reducing labor costs and allowing construction teams to focus more on core procedures. The stability of rebar tying is critical to the long-term success of a project. Equipped with an intelligent tension adjustment system, the nylon cable tie machine can flexibly adjust the binding tightness to achieve precise fixing within ±0.1mm. This avoids damaging rebar from over-tightening and prevents displacement caused by over-loosening, with a binding success rate of up to 99.9%, thoroughly eliminating industry pain points such as loose ties and unfastened bundles. Its lightweight design and ergonomic grip enable single-hand operation with 360° unrestricted access. It adapts flexibly to narrow rebar gaps as well as high-altitude working scenarios. With years of deep cultivation in the automation industry, SWIFT has developed nylon cable tie machines suitable for construction scenarios based on military-grade technological expertise. The equipment has passed 2 million consecutive operation tests with an extremely low failure rate, ensuring stable performance even in complex construction site environments such as humidity and dust. Meanwhile, its built-in waste recycling system prevents scattered tie waste, maintaining a clean construction site and supporting environmental protection. From skyscrapers to public welfare projects, every solid rebar structure relies on precise and efficient tying support. SWIFT nylon cable tie machines resolve the pain points of manual tying with advantages of high efficiency, precision and durability, building a solid line of defense for engineering quality. Choose SWIFT to empower frontline construction with intelligent equipment, safeguard every engineering detail through technological strength, and unlock a new efficient experience in rebar tying.

Founded in 2013 (R&D started in 2010), with 15 years of dedicated focus on automotive wire harness CAD/CAPP software development. Specialized in customized development for automotive electrical and wire harness industry.6 dedicated R&D engineers, 8 implementation specialists, 4 technical support staff. Leveraging university resources for stable R&D team development.Recommended 130+ graduates to various harness manufacturers, building strong industry connections and talent pipeline.

On March 25th, 2025, Suzhou Ruichuan Electromechanical Technology Co., Ltd. will make a wonderful appearance with a number of innovative products at the Munich Wire Harness Industry Exhibition and communicate with many professional visitors.As an enterprise integrating research and development, production, and sales, Ruichuan Electromechanical has always been focused on providing tooling fixtures and equipment supporting solutions for wire harness manufacturing enterprises. At this exhibition, the company will focus on showcasing star products such as wire harness assembly positioning fixtures, high and low voltage electrical testing platforms, and assembly lines. Its high-voltage electrical testing module features high precision and strong stability, effectively improving the efficiency and accuracy of wire harness testing, which has attracted much attention in the industry.The person in charge of the company stated that in the future, they will continue to increase investment in research and development and use innovative products to boost the development of the wire harness industry.

A 2-in-1 semiconductor dispensing and die bonding equipment for silver paste and other adhesives, supporting dot dispensing, pattern dispensing, and dip coating processes. Applicable to small-signal silver epoxy process power devices, sensors, SIP, Chiplet, IC, MOS, and other products.New Equipment Solution: Turret-Type MountingThe turret-type mounting mechanism is an innovative chip mounting method pioneered by Zhuoxing Semiconductor in the industry. The semiconductor silver epoxy die attach machine is equipped with six individual nozzles and adopts a multi-process parallel operation design. It performs chip mounting through multi-station rotating cycles, enabling simultaneous pick-up, mounting, and real-time vision compensation. This achieves the dual effect of "non-stop mounting" and "shortened production cycle," increasing production efficiency by 60%.The standard configuration of its mounting worktable is as follows: Meanwhile, Zhuoxing Semiconductor's self-developed pressure control system adopts direct motor connection, enabling the mounting structure to maintain stable pressure control under different resistances and achieve dynamic pressure control. Its equipment pressure value: 30-300g (±5g).Adapting to Multiple Processes: Three Dispensing Groups or Optional Dip CoatingThe semiconductor silver epoxy die attach machine supports configuration with up to four dispensing mechanisms. The machine supports both chip dispensing and packaging operations simultaneously, achieving multiple functions with one device. Customers do not need to purchase additional dispensers, providing manufacturers with a better solution.In addition, the silver epoxy die attach machine is suitable not only for dot and pattern dispensing processes but also for multi-needle dip coating processes. Process structures can be changed at any time, truly realizing "one machine, multiple uses"!Dispensing Features:① Compatible with different dispensing controllers to meet customers' multiple process requirements② Optional auxiliary functions such as frame heating based on customized process characteristics③ Enables visual recognition of dispensing positions and supports import of preset patterns and path dispensingDispensing Mechanism:Adapting to Multiple Material Types: Multi-Size Wafers and Custom TraysThe semiconductor silver epoxy die attach machine supports various sizes of blue film feeding, including 2/4/6/8/12-inch wafers, with automatic film expansion for 12-inch wafers. It supports single 6-inch mother-daughter rings, Waffle Pack, and GelPAK, and tray customization is available based on specific requirements.High Precision Guarantee: Downward Vision Accuracy CompensationIn terms of accuracy, the machine's mounting X/Y precision reaches ±15μm, angular error ≤ ±1°, production cycle 22.5k/h. Due to the turret structure design for mounting, Zhuoxing Semiconductor flexibly installs downward vision cameras or transfer stages at stations during actual operation, achieving simultaneous chip mounting and accuracy compensation, with AI automatic accuracy compensation and pressure correction functions.Against the backdrop of increasingly fierce industry competition, Zhuoxing Semiconductor is committed to providing more manufacturers with efficient and precise solutions, supporting the development of the semiconductor industry with excellent packaging technology.About UsFounded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts. 

The current semiconductor packaging environment is facing a significant contradiction: the growing demand for complex products versus rigid traditional manufacturing capabilities. Specifically, this contradiction is mainly reflected in two aspects: the multi-process nature of semiconductor packaging, and the current mainstream semiconductor mounting structures. Diverse Semiconductor Packaging Process Requirements:The Prevalence of "One Machine, One Process" Increases Corporate Capital BurdenThe back-end processes of semiconductor packaging involve various substrate materials (lead frames, PCBs, ceramics, glass, etc.) and complex interconnection processes (die attach, bonding, etc.). Different materials and processes have vastly different requirements for equipment, leading to the widespread phenomenon of "dedicated machines for dedicated uses." Lead Frame PackagingCommon processes for lead frame packaging include silver epoxy pasting and eutectic bonding. It faces the pain point of cumbersome line changeovers: a single production line needs to switch between producing silver epoxy pasting products and eutectic bonding products at any time. These two processes require completely different equipment (eutectic bonding requires a heating stage, vacuum adsorption, and high-temperature nozzles). Switching processes means replacing the entire machine, re-debugging, and recalibrating, which can take hours or even longer. PCB Substrate PackagingCommon processes for PCB substrate packaging include silver epoxy pasting and multi-chip integration, where "multi-chip integration" is the biggest challenge. A complex chip (such as SiP system-in-package) may simultaneously contain logic chips, memory chips, RF chips, etc. These chips may come from different wafers, have different thicknesses, different sizes, and even require different pasting processes. How to handle these diverse material inputs is a critical issue. Ceramic Substrate PackagingIn the production of aerospace and military products, many different processes are required, such as silver epoxy, eutectic, ultrasonic, and bonding.It not only faces the challenge of process diversification, but bonding also requires prolonged high temperature and high pressure, posing significant challenges to equipment thermal management, material thermal expansion control, and precision force control.Facing diversified substrates and processes, for many packaging manufacturers, "dedicated machines for dedicated uses" is the current "first solution," but it is not the "optimal solution." It causes huge capital waste, cannot adapt to the normalcy of order fluctuations and process iterations, and its rigid production lines force companies to invest in additional specialized equipment for each new product or process. Therefore, how to break free from the dilemma of repeated investment has become a core issue related to corporate competitiveness. Problems with Mainstream Mounting Structures:Inability to Simultaneously Balance Three Major Demands, Affecting Production CapacityBesides the "dedicated machine" phenomenon, the second major aspect of the contradiction in semiconductor packaging lies in the structure. There is a term in economics called the "impossible triangle," which also applies to semiconductor packaging. The impossible triangle in semiconductor packaging usually refers to the imbalance among "precision," "speed," and "process adaptability." How to solve this "impossible triangle" and turn it into a "process iron triangle" is a question every professional in the packaging industry needs to consider. Efficiency vs. PrecisionAchieving high efficiency requires significant acceleration of moving parts, but this generates enormous inertial forces, leading to unavoidable elastic deformation and vibration in the mechanical structure. If the excitation frequency generated by the motion happens to match a certain natural frequency of the equipment's mechanical structure, it can cause intense resonance, affecting precision.Therefore, Zhuoxing Semiconductor's motion control team designs more advanced torque feedforward and vibration suppression algorithms to solve this:① For simple point-to-point motion, we typically use kinematics-based PID control.② To improve response speed and counteract gravity, the system adopts dynamics-based torque feedforward and inertia identification.③ To address jitter issues at high speeds, engineers implement vibration-based sliding mode variable structure control algorithms. Precision vs. Process AdaptabilityEach new process introduces unique sources of interference. Changing nozzles or tools of different materials or weights alters the dynamic characteristics of the motion system. To maintain high precision, the equipment must establish independent error compensation models for every possible process configuration and tool combination.Therefore, Zhuoxing Semiconductor adopts a planar turret-type mounting architecture to perfectly compensate for this defect:Different materials have independent feeding systems, enabling support for multi-material hybrid bonding and hybrid mounting.During the operation of the mounting architecture, a transfer stage and vision inspection mechanism are installed at one station to ensure mounting precision in real time, guaranteeing production accuracy.Efficiency vs. Process AdaptabilityWhen equipment switches between different material inputs, line changeover time is needed to replace nozzles, calibrate height, and adjust process parameters. This process is very time-consuming and severely reduces overall equipment effectiveness. Dedicated equipment, however, requires no changeover and can run continuously at high speed, but completely sacrifices multi-process adaptability.Therefore, Zhuoxing Semiconductor's architecture proposes two concepts:Modular Design: Different process modules are made into plug-and-play standard units, allowing process changes through quick module replacement, solving the adaptability problem of dedicated machines.Planar Turret Architecture: Different nozzles at different stations handle different material inputs, solving the efficiency problem of multi-material integration.Solution: Planar Turret Structure III.High-Precision Packaging Equipment:Breaking the Dilemma of Equipment "Multi-Process Adaptability" and the "Impossible Triangle"Addressing the "dedicated machine" challenge posed by multi-process production demands, and the contradiction in balancing precision, speed, and process adaptability, Zhuoxing Semiconductor has independently developed two new types of equipment—the High-Precision Multi-Function Mounter and the Semiconductor Silver Epoxy Die Attach Machine. Through modular design, planar turret structure, and advanced torque feedforward and vibration suppression algorithms, these solutions help crack the problem of multi-process adaptability in equipment, find the optimal balance point best suited for current technological goals, overcome the difficulty of simultaneously achieving the "impossible triangle," and transform the impossible triangle into an iron triangle.About UsFounded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts. 

As electronic manufacturing evolves toward miniaturization and high performance, chip packaging processes face increasing challenges in precision, efficiency, and quality. Zhuoxing Semiconductor's AS7301 chip-level printer, with its industry-unique on-chip printing technology and core advantages of precise positioning and efficient printing, has become a key piece of equipment in high-end electronic manufacturing scenarios.On-chip printing technology overcomes quality and efficiency issues in power device dispensing, achieving high-precision mass production.Building on mature technological foundations, and to further meet industry production demands, the AS7301 chip-level printer has added three core new features, achieving a technological breakthrough and completing a comprehensive upgrade in production flexibility, stability, and intelligence. This provides robust support for enterprises to reduce costs and increase efficiency, contributing to the high-quality development of the electronic manufacturing industry.These three core configurations—the compatible magazine and stack feeder assembly, automatic solder paste addition function, and optional AOI component—are innovative solutions developed by Zhuoxing Semiconductor specifically targeting pain points in power device packaging production. The configuration upgrades cover the entire production process of "feeding - solder paste addition - quality inspection," achieving dual optimization of production workflow and product quality through flexible adaptation, intelligent operation, and precise control. Their application scope covers mainstream power device packaging scenarios such as high-power diodes, MOS tubes, DrMOS, and multi-chip Clip.Dual-Mode Flexible Feeding: Breaking Single Limitations, Adapting to Diverse ProductionTraditional feeding equipment has single functions, only suitable for either stack or magazine feeding methods, making it difficult to accommodate both small-batch, multi-specification and large-volume, standardized production needs. This forces enterprises to purchase additional dedicated equipment, increasing costs and space occupancy. Moreover, production changeovers involve complex debugging, frequently affecting continuous production line operation.The AS7301's new dual-mode flexible feeding system adopts a modular design, achieving "one machine, dual modes." By quickly replacing components, it can flexibly adapt to multi-specification production tasks without requiring additional equipment purchases, thereby reducing costs and increasing efficiency.Stack Feeding: Suitable for high-volume continuous production, improving stack material handling efficiency.Magazine Feeding: Adapts to standardized magazines, facilitating material management and changeovers.Customers can switch freely based on order requirements, achieving seamless transition from R&D small batches to large-scale production, greatly enhancing production line responsiveness and equipment utilization.Intelligent Automatic Solder Paste Addition: Precise Quantity Control, Eliminating Manual RelianceThe solder paste process is critical for determining soldering quality. Traditional manual addition methods have inherent limitations, including high variability in addition precision, susceptibility of solder paste to oxidation, and volatility of flux. The newly introduced automatic solder paste addition system on the AS7301 achieves precision and stability upgrades in the process through intelligent closed-loop control.Precise Metering: Automatically executes based on parameters, ensuring consistency in the amount of solder paste added.Dynamic Controllability: Continuously supplies small amounts of solder paste, reducing its exposure time to air.Quality Assurance: Inhibits oxidation and moisture absorption, maintains flux activity, ensuring reliable soldering.Cost Optimization: Precisely controls usage, reducing waste and saving costs.Fully Automatic: Realizes unmanned solder paste addition, improving overall efficiency.AOI Component: Real-Time Inspection, Data-Driven, Closed-Loop Quality ControlTraditional printing quality relies on manual spot checks, which suffer from low efficiency, susceptibility to missed inspections, and lack of systematic data support. Printing quality determines the success or failure of subsequent processes. The newly integrated AOI component in the AS7301 enables full-process control, enhancing quality assurance levels and reducing quality risks.Precise Identification: Online real-time detection of glue dot area, position offset, and shape integrity.Immediate Interception: Alarms immediately upon detecting anomalies, allowing rapid intervention to block defective products from flowing out.Data Closed Loop: Automatically records defect information and generates reports, supporting integration with MES systems.Process Optimization: Based on long-term data accumulation, reversely optimizes printing parameters, continuously improving first-pass yield.The AS7301 chip-level printer, centered on the industry-exclusive on-chip printing technology, deeply integrates the advantages of high-precision narrow-edge printing for fitting, closed-loop pressure control for uniform glue dots, and stepless steel mesh adjustment for efficient production. By superimposing the three upgraded configurations of dual-mode flexible feeding, intelligent automatic solder paste addition, and AOI real-time inspection, it builds a comprehensive competitive advantage of "core technology + full-process optimization." With its ±0.01mm position accuracy, ±0.025mm angle accuracy, and capability to adapt to complex processes like 3D step printing, it comprehensively covers precision packaging scenarios for power devices such as high-power diodes, MOS tubes, and multi-chip Clip. It precisely meets the technical demands of miniaturization and high integration in high-end electronic manufacturing, as well as the complex packaging requirements for high-density interconnection of multiple chips. Simultaneously, its stable performance solidifies the quality foundation, simplifies production lines, lowers the operational threshold, providing an efficient and reliable integrated printing solution for productions of all scales.About UsFounded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts.

Automatic Ejector Needle Switching Technology Solves Multi-Material Mixed Mounting ChallengesIn semiconductor packaging processes, multi-material integration equipment often faces the challenge of having to be compatible with chips and components of different sizes and feeding methods.When switching materials, traditional equipment typically requires ejector needle changes, with frequent shutdowns for debugging and needle replacement, seriously impacting production efficiency and continuity.01 Automatic Ejector Needle Switching TechnologySolving Efficiency Challenges in Multi-Material Mixed Mounting, Enabling Flexible ProductionHow can equipment efficiently adapt to multi-sized chips and achieve non-stop production?The key lies in Automatic Ejector Needle Switching TechnologyChips in the market vary in size and thickness. If the ejector needle remains fixed, small chips may crack, while large chips cannot be properly ejected. The role of the ejector needle is to push upward precisely from below the blue film, separating the chip edge from the film, allowing the nozzle to pick it up smoothly.Additionally, different product categories require adaptation to various chip sizes. When adapting to multi-material mixed integration mounting, ejector needles need to be replaced and equipment debugging performed, resulting in significant time waste.Based on the above reasons, equipment must possess automatic ejector needle switching capability. Without the ability to flexibly change ejector needles, each switch between different materials requires shutdown adjustment, severely impacting production efficiency.Automatic Ejector Needle Switching Technology uses a turret to quickly replace matching ejector needle modules, flexibly adapting to various chip sizes and shapes, significantly reducing line changeover downtime, and markedly improving production line efficiency and mounting precision.02 One-Time Mounting · Solving Two Major ChallengesIn high-end device packaging such as optical modules and lidar, multiple chips often need to be integrated on the same substrate.Due to material switching, traditional processes require frequent ejector needle changes, and multiple alignment steps can introduce cumulative errors, increasing mounting offset and process risks.Zhuoxing's AS8136 high-precision multi-function mounter, with automatic ejector needle switching technology, supports continuous picking and mounting of multiple different chips in one go, without manual switching and correction during the process. This achieves high-precision mounting of multi-materials in a single pass, avoiding mid-process shutdowns and material changes, eliminating repeated positioning, significantly improving precision, reducing potential defects, and ensuring overall mounting yield.Zhuoxing AS8136 High-Precision Multi-Function Mounter: Solving Multi-Product Production ChallengesZhuoxing Semiconductor's AS8136 high-precision multi-function mounter integrates automatic ejector needle switching functionality, effectively solving multi-product co-line production challenges and enabling efficient and flexible production modes.The equipment boasts the following advantages:Full Material Compatibility:Supports 2-inch to 12-inch wafers and various feeding methods including Waffle Pack and GelPAK;High-Precision Mounting:Applicable to diverse products such as optical modules, sensors, lidar, and MEMS motors;Automatic Needle Change and Calibration:No manual intervention required, reducing labor and equipment occupancy, minimizing downtime;Intelligent Module Switching:Automatically matches ejector needle modules according to chip size and shape, ensuring precise mounting.Zhuoxing AS8136 High-Precision Multi-Function MounterThrough automatic ejector needle switching technology, it rapidly adapts to mixed mounting of chips with different sizes and feeding methods, efficiently achieving chip mounting. After one-time debugging, no manual needle change or calibration is needed during production; it automatically replaces ejector needle modules, solving multi-material integration problems. It can automatically switch to the appropriate ejector needle module based on chip size and shape, ensuring precise mounting of chips onto substrates. This not only saves labor but also significantly reduces debugging downtime.About UsFounded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts. 

Mini LED, as an innovative display technology, has garnered significant market attention due to its finer display effects, higher brightness, and enhanced durability.Unlike traditional lamp bead processes, Mini LED display does not require pre-assembling red, green, and blue chips into lamp beads. Instead, it necessitates placing a massive number of LED chips directly onto a substrate. However, even among red, green, and blue chips, there can be subtle color variations between chips of the same color from different wafer rings. If placed sequentially, this would cause color differences in the final display effect. Therefore, in the actual production process of Mini LED, to achieve better optical effects and optical consistency, mixed chip production is required—commonly known as mixed mounting.Mixed mounting involves placing a large number of wafer rings, each carrying chips of the same color, onto different positions of a single substrate. This unifies the color variations between different wafer rings in the final display, resulting in a screen with better consistency.(Zhuoxing Solution Schematic Diagram)Mini LED mixed chip production simultaneously utilizes multiple different wafer rings. Typically, more than 9 wafer rings are used per unit area, with 3 rings per color to achieve screen color consistency. Zhuoxing's technology can simultaneously utilize up to 36 wafer rings, with 12 rings per color, meaning display consistency can be significantly improved.During mixed chip production, if using the traditional single-wafer-ring die bonding method, one wafer ring must be replaced after transferring all its chips. This means the number of wafer ring changes equals the total number of wafer rings used, consuming significant time and resulting in relatively low chip transfer efficiency, which impacts Mini LED chip production performance.Addressing the low efficiency of Mini LED mixed chip production, Zhuoxing pioneered the pixel die bonding method, achieving "one pick, three bonds"—simultaneously bonding three chips of R, G, and B colors in one operation, effectively transferring one complete pixel at a time. During mixed mounting, three blue films of different colors are replaced simultaneously. Consequently, the number of blue film changes is one-third that of the traditional single-wafer-ring die bonding method, simplifying the die bonding process flow, providing higher transfer efficiency and capability, and significantly improving Mini LED mixed chip production efficiency.As a semiconductor packaging solution provider, Zhuoxing innovatively offers a comprehensive pixel die bonding and mixed mounting solution, effectively solving the technical challenge of Mini LED mixed chip production speed, significantly enhancing production efficiency, and establishing itself as a leader in Mini LED pixel mixed mounting without speed reduction!No Speed Reduction During Mixed Mounting, Die Bonding Speed 60K/hCountless tests show that Zhuoxing's pixel die bonder achieves a mixed mounting efficiency of 60K/h per worktable, mixing 1000 chips per minute. While ensuring comprehensively improved pixel optical consistency and enhanced yield, it also elevates production efficiency to a new level, helping Mini LED display equipment manufacturers improve quality and efficiency, and accelerating the large-scale commercialization of Mini LED technology.Technological upgrading, cost reduction, and efficiency enhancement are the lifeblood of automation equipment enterprises. In 2023, the application scope of Mini LED displays continues to widen, driving rapid growth in demand for semiconductor devices and further optimizing costs. For Mini LED equipment manufacturers, strategically adopting next-generation die bonding technology early to improve the efficiency and quality of the Mini LED packaging process will help companies secure industry share in the future.About UsFounded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts. 

In automotive Mini LED backlight manufacturing, two core challenges are being faced:First, under the trend of "multi-category, small-batch" production, equipment compatibility and line changeover efficiency are insufficient;Second, under automotive-grade "zero defect" quality requirements, traditional die bonding yield rates and process control are difficult to achieve.Zhuoxing Semiconductor's newly launched AS3601 three-arm die bonder specifically addresses these two major pain points with technological innovation, fully meeting both efficiency and quality requirements of automotive backlight manufacturing.Efficient Production Solution for "Multi-Category, Small-Batch"01 - Full Size Coverage: Solving Equipment Resource WasteDue to the variety of automotive screen sizes, a single piece of equipment cannot be compatible with all substrate sizes. Traditional die bonding equipment often requires different machine models to be used based on product dimensions, leading to equipment idleness.Zhuoxing's AS3601 three-arm high-speed die bonder, however, can cover all substrate sizes of 270mm × 520mm and below with just one machine, perfectly适配 10 to 21-inch full series automotive backlight modules, meeting all mainstream automotive size requirements, significantly reducing equipment idleness, and solving the resource waste problem.02 - Rapid Line Changeover: Solving Changeover Time WasteWhen different products are produced on the same production line, different settings need to be switched. The "multi-product, small-batch" production mode of automotive backlighting means high frequency of line changeovers. Managing changeover efficiency is a major difficulty in improving overall production line efficiency.Most die bonding equipment on the market uses串联 line configurations for equipment connection.串联 lines not only have long changeover times but can only achieve two modes: "single machine, single product" or "multiple machines, single product," resulting in low capacity efficiency and consuming significant time.Zhuoxing Semiconductor adopts a parallel line production mode, with intelligent line configuration flexibility, significantly reducing changeover time.It not only supports conventional "single machine, single product" or "multiple machines, single product" modes but also supports "multi-product co-line" production, meaning one line can simultaneously complete the production of multiple different products.Product switching is more convenient, reducing time waste caused by line changes, greatly improving production line utilization and flexibility, easily handling "multi-category, small-batch" orders."Automotive-Grade" Quality Assurance Real-Time Inspection + AI Warning, Yield Rate Up to 99.999%01 - Visual Inspection FunctionZhuoxing's AS3601 three-arm die bonder integrates inspection into the mounting moment: pre-mounting position detection, on-the-fly flying vision correction during mounting.Through real-time visual inspection, the entire mounting process is captured in real time, ensuring mounting position accuracy of ±15μm.It also features post-mounting inspection functionality, immediately recording data when mounting deviations occur to ensure mounting precision and yield rate.Achieving:One Zhuoxing die bonder = One traditional die bonder + One post-bonding AOI02 - AI Risk WarningCombined with AI algorithms, it performs risk prediction and alerts. It immediately alarms when detecting conditions that could cause defects, preventing偏移 and defects at the source.Example: Taking solder paste printing misalignment as an example. If the chip is placed directly, the misalignment will increase after reflow soldering. If AI risk warning is added, when solder paste is misaligned, the AI algorithm calculates the optimal position for chip placement, thereby reducing misalignment after reflow soldering. Intelligent Production Management System, Traceable QualityUnder the "automotive-grade" zero-defect requirement, the yield rate requirements for chip mounting are increasingly high, and the ability to trace the mounting process of each module is necessary.01 - Placement Mapping ManagementZhuoxing Semiconductor is equipped with Mapping functionality, recording the chip mounting path,实时统计 chip yield rate in real time, enabling intelligent production lines and traceable quality.02 - Intelligent MES SystemPerforms quality management, binds data for each substrate,实时统计 yield rate and first-pass yield in real time, making the production line more intelligent.About UsFounded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts. 

Kanota · Expert in Dispensing & PottingFounded in 2009, we are a leading manufacturer of fluid automation in China, specializing in precision dispensing, potting, coating, and customized industrial equipment.Equipped with core intellectual property rights, we hold 35 national patents (pending additional items). Certified with ISO9001 Quality Management System, we collaborate closely with Nanjing University of Aeronautics and Astronautics, Soochow University, etc., to develop cutting-edge technologies.Guided by our core values of Innovation, Professionalism, Service, and Excellence, and driven by our mission of "Serving Customers, Creating Value", we aim to become a leader in intelligent fluid control, delivering premium solutions for global high-end manufacturing.

Dear industry colleagues and partners, The highly anticipated 2026 Munich Shanghai Electronics Production Equipment Exhibition (productronica China) will grandly open from March 25th to 27th at the Shanghai New International Expo Center. At that time, Changxu Technology will showcase a range of high-quality adhesives and systematic solutions at the exhibition. Here, we sincerely invite you to visit Booth 1926 in Hall W1 for guidance and discussion on cutting-edge technology and potential business cooperation!Since its establishment in 2002, Changxu Technology has always adhered to the concept of pursuing excellence and innovative development. We continuously explore the innovations of new materials and processes in the industry and have established professional sales and technical teams in East China, South China, Southwest China, and North China to ensure rapid response to customer needs.As a technology-driven enterprise, we have a mature technical team and systematic service processes. From new product introduction, sample provision, to solution design and after-sales support, we provide full-process one-stop services. We have closely collaborated with over 15 top suppliers, developed 50 industry solutions, gained recognition from 2000 customers, and covered more than 20 industries, becoming an important supplier in fields such as communication, industrial, medical, automotive, 3C, and semiconductor sectors.At this exhibition, Changxu Technology will bring a full range of core products:1. DOWSIL Silicone Encapsulation AdhesivesProducts: CN8760, TC6020, TC6015, TC6040, 184Features: Two-component encapsulation adhesive, supports room temperature/heated curing, forms elastomer after curing, provides integrated protection including waterproofing, shock resistance, insulation, thermal conductivity, anti-contamination, and high-low temperature resistance, widely used for electronic components, power supplies, automotive electronics, and PCB encapsulation protection.2. LOCTITE Epoxy Encapsulation AdhesiveProducts: 2850FTFeatures: Two-component encapsulation adhesive with good electrical insulation, flexible curing time, excellent thermal shock resistance. Can be used with CAT 9, CAT 11, CAT 23LV, CAT 24LV, CAT 27-1 curing agents. Different curing agent ratios can achieve varied performance.3. LOCTITE Instant AdhesivesProducts: 401, 403, 438, 460, 495, 496Features: Rapid initial setting in 5 seconds, high shear strength, suitable for quick assembly and repair, with excellent adhesion on plastics, porous materials, elastomers, metals, and other substrates.4. DOWSIL Conformal CoatingsProducts: CC-2588Features: Fast curing, surface hardness Shore A 76 after curing, tensile strength 7.7 MPa, excellent mechanical protection and insulation properties, suitable for rigid and flexible circuit boards, electronic printed wiring boards (PWB), and scenarios requiring high toughness, wear resistance, and long-term stability.5. DOWSIL Thermal Conductive AdhesiveProduct: SE 4420Features: Single-component semi-fluid with a thermal conductivity of 0.92 W/mK, capable of stable operation in a wide temperature range of -45℃ to 200℃. Combines strength and flexibility, excellent insulation performance, suitable for high-efficiency heat dissipation in automotive lighting, telecommunications, and power supply equipment.6. Other Featured Products: Threadlockers: 222, 243, 263, 290; Metal Cleaners: M18, SF7649At the same time, the exhibition will showcase customized solutions focusing on core needs such as thermal management, bonding, sealing, potting, and coating, precisely adapted for applications in new energy vehicles, consumer electronics, industrial control, and electronic and electrical fields.Changxu Booth: Hall W1, No. 1926Location Guidance: Enter through Entrance Hall 1 and turn left to reach Hall W1; Booth 1926 is located next to the vertical corridor between Gates 5-10.Empowering technology, bonding the future. Changxu Technology sincerely invites you to attend this industry event to explore innovations in adhesive technology and discover new cooperation opportunities, working together to promote high-quality development in the electronics manufacturing industry.March 25-27See you there!

In industrial production, counterweights are indispensable components for copper pipe fittings. Though not complex structures, they are added to adapt to the functions of copper pipe fittings, balance torque, and ensure stable operation. They are widely used in pipeline grounding, electrical equipment, fluid transmission, and other scenarios. The firmness of their bundling directly determines the safety and service life of copper pipe fittings. Traditional bundling of copper pipe fitting counterweights mostly relies on manual operation, which is not only time-consuming and labor-intensive but also prone to problems such as uneven tightness and loosening of cable ties. Especially for mass processing of copper pipe fittings, manual work suffers from low efficiency and high rework rates, increasing labor costs and delaying production schedules. How to bundle counterweights and copper pipe fittings efficiently and accurately has become an urgent demand for many enterprises. The launch of the Swift Handheld Cable Tie Machine completely solves this industry pain point and becomes an ideal assistant for bundling copper pipe fitting counterweights. As a professional brand focusing on automatic bundling equipment, Swift’s handheld cable tie machine, with its exquisite craftsmanship and user-friendly design, perfectly meets the bundling requirements of copper pipe fitting counterweights, turning tedious work into efficient and convenient operation. The Swift Handheld Cable Tie Machine features a lightweight body and comfortable grip, designed in line with ergonomics to reduce fatigue even during long hours of operation. It flexibly adapts to copper pipe fitting counterweight bundling in various scenarios. The machine automatically completes the whole process of feeding, tightening, cutting, and waste disposal, finishing one bundling cycle in just 1.2 seconds. Its efficiency far exceeds manual work, greatly saving labor costs. Notably, the Swift Handheld Cable Tie Machine allows precise adjustment of bundling tension. It firmly fixes counterweights on copper pipe fittings to prevent loosening and falling off without damaging the surface of copper pipe fittings, balancing firmness and safety. Compatible with various specifications of cable ties and requiring frequent adjustments, it easily handles copper pipe fittings and counterweights of different sizes, boasting strong versatility. From the tedious and inefficient manual bundling to the high-efficiency and precision of the Swift Handheld Cable Tie Machine, copper pipe fitting counterweight bundling has achieved a brand-new upgrade. Choosing Swift means choosing not just a tool, but also an efficient and worry-free production method. It helps enterprises improve productivity and reduce costs, ensuring every copper pipe fitting counterweight is securely bundled and safeguarding product quality.