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Mini LED, as an innovative display technology, has garnered significant market attention due to its finer display effects, higher brightness, and enhanced durability.

Unlike traditional lamp bead processes, Mini LED display does not require pre-assembling red, green, and blue chips into lamp beads. Instead, it necessitates placing a massive number of LED chips directly onto a substrate. However, even among red, green, and blue chips, there can be subtle color variations between chips of the same color from different wafer rings. If placed sequentially, this would cause color differences in the final display effect. Therefore, in the actual production process of Mini LED, to achieve better optical effects and optical consistency, mixed chip production is required—commonly known as mixed mounting.

Mixed mounting involves placing a large number of wafer rings, each carrying chips of the same color, onto different positions of a single substrate. This unifies the color variations between different wafer rings in the final display, resulting in a screen with better consistency.

(Zhuoxing Solution Schematic Diagram)

Mini LED mixed chip production simultaneously utilizes multiple different wafer rings. Typically, more than 9 wafer rings are used per unit area, with 3 rings per color to achieve screen color consistency. Zhuoxing's technology can simultaneously utilize up to 36 wafer rings, with 12 rings per color, meaning display consistency can be significantly improved.

During mixed chip production, if using the traditional single-wafer-ring die bonding method, one wafer ring must be replaced after transferring all its chips. This means the number of wafer ring changes equals the total number of wafer rings used, consuming significant time and resulting in relatively low chip transfer efficiency, which impacts Mini LED chip production performance.

Addressing the low efficiency of Mini LED mixed chip production, Zhuoxing pioneered the pixel die bonding method, achieving "one pick, three bonds"—simultaneously bonding three chips of R, G, and B colors in one operation, effectively transferring one complete pixel at a time. During mixed mounting, three blue films of different colors are replaced simultaneously. Consequently, the number of blue film changes is one-third that of the traditional single-wafer-ring die bonding method, simplifying the die bonding process flow, providing higher transfer efficiency and capability, and significantly improving Mini LED mixed chip production efficiency.

As a semiconductor packaging solution provider, Zhuoxing innovatively offers a comprehensive pixel die bonding and mixed mounting solution, effectively solving the technical challenge of Mini LED mixed chip production speed, significantly enhancing production efficiency, and establishing itself as a leader in Mini LED pixel mixed mounting without speed reduction!

No Speed Reduction During Mixed Mounting, Die Bonding Speed 60K/h

Countless tests show that Zhuoxing's pixel die bonder achieves a mixed mounting efficiency of 60K/h per worktable, mixing 1000 chips per minute. While ensuring comprehensively improved pixel optical consistency and enhanced yield, it also elevates production efficiency to a new level, helping Mini LED display equipment manufacturers improve quality and efficiency, and accelerating the large-scale commercialization of Mini LED technology.

Technological upgrading, cost reduction, and efficiency enhancement are the lifeblood of automation equipment enterprises. In 2023, the application scope of Mini LED displays continues to widen, driving rapid growth in demand for semiconductor devices and further optimizing costs. For Mini LED equipment manufacturers, strategically adopting next-generation die bonding technology early to improve the efficiency and quality of the Mini LED packaging process will help companies secure industry share in the future.

About Us

Founded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.

Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.

We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts.