AS8136 High Precision Semiconductor Die Bonder | productronica Shanghai AS8136 High Precision Semiconductor Die Bonder,Surface mount technology,productronica Shanghai AS8136 High Precision Semiconductor Die Bonder.Core equipment for high-end semiconductor packaging adopts a third-generation rotary turret mounting mechanism, eliminating reciprocating motion losses and increasing production efficiency by 60%. With an ultra-high placement accuracy of ±3 microns and an angular control precision of ≤0.1°, it is widely used in advanced packaging fields such as optical modules, LiDAR, sensors, SIP, and 1.6T optical modules. The equipment supports chip sizes ranging from 6*6mil to 400*400mil, achieves flexible production capacities from 1.2k/h to 12k/h, and features an AI-powered high-precision closed-loop pressure control system. It is compatible with the mixed placement of various material types, providing customers with high-precision and high-reliability packaging solutions.
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Product Introduction

AS8136 High Precision Semiconductor Die Bonder
AS8136 High Precision Semiconductor Die Bonder.Core equipment for high-end semiconductor packaging adopts a third-generation rotary turret mounting mechanism, eliminating reciprocating motion losses and increasing production efficiency by 60%. With an ultra-high placement accuracy of ±3 microns and an angular control precision of ≤0.1°, it is widely used in advanced packaging fields such as optical modules, LiDAR, sensors, SIP, and 1.6T optical modules. The equipment supports chip sizes ranging from 6*6mil to 400*400mil, achieves flexible production capacities from 1.2k/h to 12k/h, and features an AI-powered high-precision closed-loop pressure control system. It is compatible with the mixed placement of various material types, providing customers with high-precision and high-reliability packaging solutions.
Conventional Products
Product Category:
Surface mount technology
Application Area:
Industrial Electronics
Communication Systems
Computers&Peripherals
Automotive Industry
Medical Technology
New Energy
Aviation&Space Technology
Military Electronics
Mechanical Engineering
Lighting engineering

Exhibitor Profile

ASMADE Semiconductor Technology Limited
深圳市卓兴半导体科技有限公司
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Our Booth No.
E5 .
5272
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