AS8123 Epoxy Die Bonder | productronica Shanghai AS8123 Epoxy Die Bonder,Surface mount technology,productronica Shanghai AS8123 Epoxy Die Bonder,Designed specifically for the semiconductor packaging field, this equipment features a four-point dispensing mechanism and is adaptable to multi-size wafers. It is widely used in applications such as sensors, SIP, Chiplet, IC, silver epoxy process power devices, and MOS. The equipment achieves a placement X/Y accuracy of ±15 micrometers and an angular error of ≤±1°, with a maximum production capacity of 22.5k/h. It is compatible with chip sizes ranging from 6*6mil to 80*80mil and 50*50mil to 400*400mil. Equipped with a high-precision downward-looking camera, it incorporates AI-powered automatic accuracy compensation and pressure correction functions. It supports optional configurations of different dispensing controllers for pick-and-place cycles and allows for flexible nozzle switching to accommodate various material types, providing a reliable solution for efficient and high-precision semiconductor packaging.
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Product Introduction

AS8123 Epoxy Die Bonder
AS8123 Epoxy Die Bonder,Designed specifically for the semiconductor packaging field, this equipment features a four-point dispensing mechanism and is adaptable to multi-size wafers. It is widely used in applications such as sensors, SIP, Chiplet, IC, silver epoxy process power devices, and MOS. The equipment achieves a placement X/Y accuracy of ±15 micrometers and an angular error of ≤±1°, with a maximum production capacity of 22.5k/h. It is compatible with chip sizes ranging from 6*6mil to 80*80mil and 50*50mil to 400*400mil. Equipped with a high-precision downward-looking camera, it incorporates AI-powered automatic accuracy compensation and pressure correction functions. It supports optional configurations of different dispensing controllers for pick-and-place cycles and allows for flexible nozzle switching to accommodate various material types, providing a reliable solution for efficient and high-precision semiconductor packaging.
Conventional Products
Product Category:
Surface mount technology
Application Area:
Industrial Electronics
Communication Systems
Computers&Peripherals
Automotive Industry
Medical Technology
New Energy
Aviation&Space Technology
Military Electronics
Mechanical Engineering
Lighting engineering

Exhibitor Profile

ASMADE Semiconductor Technology Limited
深圳市卓兴半导体科技有限公司
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Our Booth No.
E5 .
5272
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