AS3601 Pixel Die Bonder | productronica Shanghai AS3601 Pixel Die Bonder,Surface mount technology,productronica Shanghai AS3601 Pixel Die Bonder,specifically designed for Mini LED COB ultra-high-definition display scenarios, features a high-efficiency "one exposure, three bonding" technology. By optimizing the motion path, it achieves exceptional productivity, reaching up to 90k/h (75k/h under Pitch 1.0 specifications). The equipment supports single-color 12-ring mixed bonding and RGB 36-ring mixed bonding schemes, enabling high-precision color placement. With a parallel connection design, automatic ring changer, flying vision, and correction functions, the equipment utilization rate is significantly improved. It offers placement accuracy of <±15μm, angular deviation of <3°, and compatibility with chip sizes ranging from 3*5mil to 20*20mil. Additionally, it supports single-machine multi-ring and multi-machine multi-ring combined mixing, providing a stable and efficient core solution for ultra-high-definition display packaging.
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Product Introduction

AS3601 Pixel Die Bonder
AS3601 Pixel Die Bonder,specifically designed for Mini LED COB ultra-high-definition display scenarios, features a high-efficiency "one exposure, three bonding" technology. By optimizing the motion path, it achieves exceptional productivity, reaching up to 90k/h (75k/h under Pitch 1.0 specifications). The equipment supports single-color 12-ring mixed bonding and RGB 36-ring mixed bonding schemes, enabling high-precision color placement. With a parallel connection design, automatic ring changer, flying vision, and correction functions, the equipment utilization rate is significantly improved. It offers placement accuracy of <±15μm, angular deviation of <3°, and compatibility with chip sizes ranging from 3*5mil to 20*20mil. Additionally, it supports single-machine multi-ring and multi-machine multi-ring combined mixing, providing a stable and efficient core solution for ultra-high-definition display packaging.
Conventional Products
Product Category:
Surface mount technology
Application Area:
Industrial Electronics
Communication Systems
Computers&Peripherals
Automotive Industry
Medical Technology
New Energy
Aviation&Space Technology
Military Electronics
Mechanical Engineering
Lighting engineering

Exhibitor Profile

ASMADE Semiconductor Technology Limited
深圳市卓兴半导体科技有限公司
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Our Booth No.
E5 .
5272
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