产品介绍
3D SEMI AOI - TR7700Q SII-S
The TR7700Q SII-S is the next-generation AI-powered Inspection platform for the Semiconductor & Advanced Packaging Industry. The 3D SEMI AOI is enhanced with metrology capabilities and multiple imaging technologies to achieve full coverage inspection. The 2.5 μm High Resolution platform solution can inspect wire diameters of up to 15 μm (0.6 mil). The 3D AOI supports current Smart Factory Standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
常规产品
产品分类：
表面贴装技术
测试测量和质量保证
电子组装自动化
应用领域：
汽车
医疗
通信系统
航空航天
展商信息
我们的展位号
E5
.
5328
5328
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