Semiconductor precision dispensing UV curing furnace

Semiconductor precision dispensing UV curing furnace | productronica China Semiconductor precision dispensing UV curing furnace,Dispensing & Bonding,productronica China Product Name: Semiconductor Precision Glue UV Curing Furnace Specification: HT-UVAP352-F300S Application paradigm UV glue encapsulation curing multi band glue curing Technical Requirements: Power requirement: 380VAC 50HZ portable power bank 3M Dimensions: L1200 * W1158 * H1880 (mm) Whole machine power:~8KW Ground clearance height: 880 ± 25 Product height: ± 100mm Auxiliary shooting area: 350 * 100 (mm) Track: 50~450mm Cooling method: air cooling+industrial air conditioner Line speed: 0.2~3.0m/min

Product Introduction

Semiconductor precision dispensing UV curing furnace

Product Name: Semiconductor Precision Glue UV Curing Furnace Specification: HT-UVAP352-F300S Application paradigm UV glue encapsulation curing multi band glue curing Technical Requirements: Power requirement: 380VAC 50HZ portable power bank 3M Dimensions: L1200 * W1158 * H1880 (mm) Whole machine power:~8KW Ground clearance height: 880 ± 25 Product height: ± 100mm Auxiliary shooting area: 350 * 100 (mm) Track: 50~450mm Cooling method: air cooling+industrial air conditioner Line speed: 0.2~3.0m/min

Conventional Products

Product Category:

Dispensing & Bonding

Application Area:

Industrial Electronics

Consumer Electronics

Household appliances

Automotive Industry

Medical Technology

New Energy

Military Electronics

Exhibitor Profile

东莞市欣浩天自动化设备有限公司

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Our Booth No.

W1 .
1688

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Product Introduction

Exhibitor Profile