Product Introduction
Nano silver paste
Nano-silver paste: sprayed using an electric hydrodynamic inkjet device to form conductive droplets of 5-20um, achieving massive transfer bonding of Micro-Led; significantly improving the resolution and mass production of Micro-Led.
Product features:
1: Nanoscale particle size; can be continuously sprayed with 5-20um needles;
2: Excellent ball formation performance on driver backplanes, enabling massive bonding of Micro-Led chips.
3: Suitable for laser welding process curing, achieving 100% lighting rate after silver paste curing.
4: Excellent reliability: operating temperature can reach 125°C.
2025 New Product
Product Category:
Electronic Chemical Materials
Application Area:
Industrial Electronics
Communication Systems
Consumer Electronics
Household appliances
Computers&Peripherals
Automotive Industry
New Energy
Aviation&Space Technology
Military Electronics
Exhibitor Profile
Our Booth No.
W1
.
1250
1250
Please read carefully.
Disclaimer
Join our social media
©Messe Muenchen Shanghai Co., Ltd.
沪公网安备31011502016746号