Product Introduction
Contact Soldering
The Nexus soldering system guarantees the best results with a reflow soldering process using contact heat in a vacuum. This enables you to meet the highest requirements in the field of advanced packaging and power electronics. Productivity increases and quality advantages are achieved in the manufacturing of these components like this. In this way, the vacuum ensures oxide-free processes, as well as improved wetting and thus better filling of soldered joints. In addition, the vacuum drastically reduces the voids in soldered joints and enables processes such as plasma cleaning and atmosphere exchange for advanced packaging. Temperatures of up to 400°C can be used as standard.
Conventional Products
Product Category:
Surface mount technology
Application Area:
Industrial Electronics
Communication Systems
Consumer Electronics
Household appliances
Computers&Peripherals
Automotive Industry
Medical Technology
New Energy
Aviation&Space Technology
Military Electronics
Mechanical Engineering
Rail Transit
Security&protection system
Lighting engineering
Intelligent building
Others
Exhibitor Profile
Our Booth No.
E4
.
4518
4518
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