Online Catalogue - Exhibitor News

Dear industry colleagues and partners,

The highly anticipated 2026 Munich Shanghai Electronics Production Equipment Exhibition (productronica China) will grandly open from March 25th to 27th at the Shanghai New International Expo Center. At that time, Changxu Technology will showcase a range of high-quality adhesives and systematic solutions at the exhibition. Here, we sincerely invite you to visit Booth 1926 in Hall W1 for guidance and discussion on cutting-edge technology and potential business cooperation!

Since its establishment in 2002, Changxu Technology has always adhered to the concept of pursuing excellence and innovative development. We continuously explore the innovations of new materials and processes in the industry and have established professional sales and technical teams in East China, South China, Southwest China, and North China to ensure rapid response to customer needs.

As a technology-driven enterprise, we have a mature technical team and systematic service processes. From new product introduction, sample provision, to solution design and after-sales support, we provide full-process one-stop services. We have closely collaborated with over 15 top suppliers, developed 50 industry solutions, gained recognition from 2000 customers, and covered more than 20 industries, becoming an important supplier in fields such as communication, industrial, medical, automotive, 3C, and semiconductor sectors.

At this exhibition, Changxu Technology will bring a full range of core products:

1. DOWSIL Silicone Encapsulation Adhesives
Products: CN8760, TC6020, TC6015, TC6040, 184
Features: Two-component encapsulation adhesive, supports room temperature/heated curing, forms elastomer after curing, provides integrated protection including waterproofing, shock resistance, insulation, thermal conductivity, anti-contamination, and high-low temperature resistance, widely used for electronic components, power supplies, automotive electronics, and PCB encapsulation protection.

2. LOCTITE Epoxy Encapsulation Adhesive
Products: 2850FT
Features: Two-component encapsulation adhesive with good electrical insulation, flexible curing time, excellent thermal shock resistance. Can be used with CAT 9, CAT 11, CAT 23LV, CAT 24LV, CAT 27-1 curing agents. Different curing agent ratios can achieve varied performance.

3. LOCTITE Instant Adhesives
Products: 401, 403, 438, 460, 495, 496
Features: Rapid initial setting in 5 seconds, high shear strength, suitable for quick assembly and repair, with excellent adhesion on plastics, porous materials, elastomers, metals, and other substrates.

4. DOWSIL Conformal Coatings
Products: CC-2588
Features: Fast curing, surface hardness Shore A 76 after curing, tensile strength 7.7 MPa, excellent mechanical protection and insulation properties, suitable for rigid and flexible circuit boards, electronic printed wiring boards (PWB), and scenarios requiring high toughness, wear resistance, and long-term stability.

5. DOWSIL Thermal Conductive Adhesive
Product: SE 4420

Features: Single-component semi-fluid with a thermal conductivity of 0.92 W/mK, capable of stable operation in a wide temperature range of -45℃ to 200℃. Combines strength and flexibility, excellent insulation performance, suitable for high-efficiency heat dissipation in automotive lighting, telecommunications, and power supply equipment.

6. Other Featured Products: Threadlockers: 222, 243, 263, 290; Metal Cleaners: M18, SF7649

At the same time, the exhibition will showcase customized solutions focusing on core needs such as thermal management, bonding, sealing, potting, and coating, precisely adapted for applications in new energy vehicles, consumer electronics, industrial control, and electronic and electrical fields.

Changxu Booth: Hall W1, No. 1926

Location Guidance: Enter through Entrance Hall 1 and turn left to reach Hall W1; Booth 1926 is located next to the vertical corridor between Gates 5-10.

Empowering technology, bonding the future. Changxu Technology sincerely invites you to attend this industry event to explore innovations in adhesive technology and discover new cooperation opportunities, working together to promote high-quality development in the electronics manufacturing industry.

March 25-27

See you there!