CF910-C Wafer Die 6-Side Defect Inspection System | productronica Shanghai CF910-C Wafer Die 6-Side Defect Inspection System,Test and measurement, quality assurance,productronica Shanghai The CFW910-C is an ultra-high resolution six-sided inspection system specially designed for silicon capacitors, chip dies and other products. It enables full-dimensional defect screening of dies and delivers high-spec quality assurance for diced wafer dies. It supports die sizes of 0.2mm×3mm and is compatible with 6-inch/8-inch UV film loading, adopting a wafer cassette/UV film unloading mode to adapt to the automated transmission requirements of production lines. Equipped with six sets of high-pixel resolution imaging systems, the device achieves a pixel resolution of 800nm on all six sides and features a dedicated auto-focus module, which can identify cracks with a minimum width of 1μm. Combined with a UPH processing capacity of 2k (based on 0.25mm die data), it ensures inspection accuracy while realizing efficient 100% inspection coverage. In addition, the CFW910-C incorporates a coated gold surface anti-pressure process design and an early warning function, and is equipped with a nozzle life monitoring function to accurately alert for abnormal conditions. It supports alarm for abnormal unloading of wafer cassettes, and each die is assigned a unique serial number to enable full-process traceability and source tracking, helping customers improve production line yield and reduce quality risks.
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Product Introduction

CF910-C Wafer Die 6-Side Defect Inspection System
The CFW910-C is an ultra-high resolution six-sided inspection system specially designed for silicon capacitors, chip dies and other products. It enables full-dimensional defect screening of dies and delivers high-spec quality assurance for diced wafer dies. It supports die sizes of 0.2mm×3mm and is compatible with 6-inch/8-inch UV film loading, adopting a wafer cassette/UV film unloading mode to adapt to the automated transmission requirements of production lines. Equipped with six sets of high-pixel resolution imaging systems, the device achieves a pixel resolution of 800nm on all six sides and features a dedicated auto-focus module, which can identify cracks with a minimum width of 1μm. Combined with a UPH processing capacity of 2k (based on 0.25mm die data), it ensures inspection accuracy while realizing efficient 100% inspection coverage. In addition, the CFW910-C incorporates a coated gold surface anti-pressure process design and an early warning function, and is equipped with a nozzle life monitoring function to accurately alert for abnormal conditions. It supports alarm for abnormal unloading of wafer cassettes, and each die is assigned a unique serial number to enable full-process traceability and source tracking, helping customers improve production line yield and reduce quality risks.
Conventional Products
Product Category:
Test and measurement, quality assurance
Application Area:
Industrial Electronics

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Zhuhai Chengfeng Electronic Technology Co., Ltd.
珠海诚锋电子科技有限公司
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