Product Introduction
3D SPI
ALeader's third-generation 3D SPI is equipped with a bi-directional projected light system technology, which fully resolves shadow and diffuse reflection issues during inspection, enhancing the precision of solder paste 3D inspection. It also features a 12M-pixel high-speed camera for faster inspection and more detailed, rich images. This system effectively detects defects in solder paste printing, including volume, area, height, shift, insufficient/excess solder, solder bridging, solder icicles, and contamination, significantly aiding SMT production lines in electronics manufacturing to achieve higher automation, improved quality, enhanced efficiency, and reduced costs.
Conventional Products
Product Category:
Test and measurement, quality assurance
Application Area:
Industrial Electronics
Communication Systems
Consumer Electronics
Household appliances
Computers&Peripherals
Automotive Industry
Medical Technology
New Energy
Aviation&Space Technology
Military Electronics
Mechanical Engineering
Rail Transit
Security&protection system
Lighting engineering
Intelligent building
Exhibitor Profile
Our Booth No.
E5
.
5302
5302
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